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    <title>Engineering Update</title>
    <link>http://www.engr.uiuc.edu/communications/eupdate/</link>
    <description>Student Newsletter of the College of Engineering University of Illinois at Urbana-Champaign</description>
    <copyright>Copyright 2008</copyright>
    <language>en-us</language>
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<pubDate>Sun, 31 Aug 2008 00:00:00 -0500</pubDate>
<lastBuildDate>Sun, 31 Aug 2008 00:00:00 -0500</lastBuildDate>
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      <title>Join Engineering Student Alumni Ambassadors</title>
      <description>Engineering Student Alumni Ambassadors (ESAA) is a student-run, college-sponsored organization that works with College of Engineering administrators to improve student-alumni relations. ESAA hosts a number of events annually that allow students and alumni to interact, ranging from receptions following career fairs to a Homecoming tailgate. These interactions are a great way to gain insight into the Engineering industry and improve your networking and leadership abilities, all while serving as a key representative of the College of Engineering.&lt;br&gt;&lt;br&gt;ESAA is looking for dedicated and outgoing individuals who are able to communicate effectively. Questions? Email esaa@engr.uiuc.edu. For more information and an application, visit </description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1046</link>
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      <pubDate>Thu, 04 Sep 2008 00:00:00 -0500</pubDate>
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      <title>Undergraduate Minor: Environmental Fellows Program Spring 2009 Enrollment</title>
      <description>The Environmental Council is looking for dedicated students to participate in our EFP undergraduate minor program, through which students are given education opportunities above and beyond the usual. For more information, visit</description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1047</link>
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      <pubDate>Thu, 04 Sep 2008 00:00:00 -0500</pubDate>
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      <title>BMES, First Official Meeting</title>
      <description>Come on out to the first official meeting for the Bio-Medical Engineering Society, the only official professional society for all things Bio-Medical. Meeting is primarily informational, including free pizza and presentations from the officer board. All majors are welcome to attend.</description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1041</link>
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      <pubDate>Tue, 02 Sep 2008 00:00:00 -0500</pubDate>
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      <title>New Synthetic Biology Course</title>
      <description>An independent study course, an &amp;#39;Introduction to Synthetic Biology&amp;#39; is being offered by Dr. Ido Golding. The course is limited to seven (7) students and is open to anyone. Synthetic biology is an emerging engineering discipline that applies engineering principles to biology. Such principles include the standardization of modular components the hierarchical abstraction of complex systems and the characterization of both components and systems to biology allowing the decoupling of construction from design. Novel biological systems may be engineered to solve industrial, medical, and environmental problems such as the bioremediation of toxic waste, the microbial production of the anti-malarial drug artemisinin, and the biosynthesis of hydrogen or butanol as an alternative fuel source. But this is only the tip of the proverbial iceberg.  Email Aleem Zafar, husain3@uiuc.edu, regarding your interest in taking this course. Include your major, your year in school, and your free hours between 8:00 a.m. and 4:00 p.m. on Wednesday and Thursday. These are necessary so that we can coordinate and tailor the course. &amp;lt;br&amp;gt;&amp;lt;br&amp;gt;</description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1042</link>
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      <pubDate>Tue, 02 Sep 2008 00:00:00 -0500</pubDate>
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      <title>IEEE Intel Information Session</title>
      <description>Come learn about a company with annual revenue greater than $40 billion. Intel is the world&amp;#39;s largest semiconductor company and the leader in microprocessors and they want you. Bring your résumé and meet the reps. Free Papa Del&amp;#39;s Pizza.</description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1044</link>
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      <pubDate>Mon, 01 Sep 2008 00:00:00 -0500</pubDate>
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      <title>IEEE Qualcomm Info Session</title>
      <description>Qualcomm has been one of the main players in &amp;#39;enabling the wireless industry.&amp;#39; This technological heavyweight wants you to work for them. Bring your résumé; free Papa Del’s Pizza.</description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1045</link>
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      <pubDate>Mon, 01 Sep 2008 00:00:00 -0500</pubDate>
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      <title>Engineering Council - Open Committee Positions</title>
      <description>Engineering Council is looking for motivated individuals to fill open committee positions. EC committees are responsible for planning many of the most visible events and programs on campus. The following committees are still seeking applicants. Feel free to email the contact person if you want to see what positions are open, or want more information.&lt;br&gt;- E-Week Committee - Plans E-Weeks, rgrzyb2@illinois.edu&lt;br&gt;- Corporate Committee - Organizes EXPO, the engineering career fair, aahmed25@illinois.edu&lt;br&gt;- Responsible for planning Engineering Open House, yangzhao@illinois.edu&lt;br&gt;- Leadership - Plans events to improve leadership skills, eriley2@illinois.edu&lt;br&gt;- FEO - Future Enrichment Opportunities plans workshops for research opportunities, pkofkin2@illinois.edu&lt;br&gt;- EIB - Engineering Information Bureau leads the recruiting effort for the college, sabouez2@illinois&lt;br&gt;- SITE - SITE plans a weekend-long introduction to the college for accepted students, vschin2@illinois.edu&lt;br&gt;- Awards - Gives out awards to societies and plans the committed students banquet, pzaveri2@illinois.edu&lt;br&gt;- Social - Plans many fun, relaxing events to balance all the studying, tkenned4@illinois.edu&lt;br&gt;- ECIT - Responsible for maintaining the servers, and EC websites - ablumen2@illinois.edu</description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1040</link>
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      <pubDate>Mon, 01 Sep 2008 00:00:00 -0500</pubDate>
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      <title>ACM Open House</title>
      <description>ACM Special Interest Groups (SIGs) will each be presenting a short presentation describing their area of focus, projects, and meeting times. Pizza and beverages will be provided. A list of sigs can be found at </description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1039</link>
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      <pubDate>Sat, 30 Aug 2008 00:00:00 -0500</pubDate>
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      <title>Engineering Employment Expo Fall 2008</title>
      <description>The Engineering Employment EXPO connects students looking for internships, co-op positions, and full-time jobs to over 275 companies. The EXPO is the largest job fair on our campus and second largest in the nation. Expo has moved to the I-Hotel and Conference Center, located just south of Assembly Hall. Parking is free at the conference center or you can take the MTD 23 Shuttle bus. Don&amp;#39;t forget to wear your business professional attire.&lt;br&gt;&lt;br&gt;To ensure that the Fall 2008 Engineering Employment Expo is successful for students and companies the Expo Committee needs student volunteers. Sign up at http://expo.ec.uiuc.edu/students_volunteer.php. For more info, see</description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1038</link>
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      <pubDate>Sat, 30 Aug 2008 00:00:00 -0500</pubDate>
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      <title>IEEE Lyondell Info Session</title>
      <description>Come learn about the exciting application of ECE in the burgeoning chemical company. Lyondell is a leader, with annual revenue over $40 billion. Bring your résumé and start building your professional relationships. Pizza will be provided.</description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1036</link>
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      <pubDate>Fri, 29 Aug 2008 00:00:00 -0500</pubDate>
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      <title>IEEE Gerdau Ameristeel Info Session</title>
      <description>Come learn about Gerdau Ameristeel, the largest producer of long steel in the Americas with annual revenue over $20 billion. Bring your résumé and start building your professional relationships. Pizza will be provided.</description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1037</link>
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      <pubDate>Fri, 29 Aug 2008 00:00:00 -0500</pubDate>
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      <title>Open Lecture - The Globalization of Engineering:  The Impact on Engineers and their Education</title>
      <description>H. Steven Gilbert serves as senior vice president of Human Resources and Administration for Fluor Corporation, where he is responsible for the company&amp;#39;s human resources, executive services, real estate and office services functions. Fluor Corporation is one of the world&amp;#39;s largest, publicly owned engineering, procurement, construction, and maintenance services companies. Gilbert&amp;#39;s lecture topic is &amp;#39;The Globalization of Engineering: The Impact on Engineers and their Education.&amp;#39;</description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1026</link>
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      <pubDate>Fri, 29 Aug 2008 00:00:00 -0500</pubDate>
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      <title>Silicon Valley Workshop Opportunity</title>
      <description>The Technology Entrepreneur Center and the College of Engineering would like to send up to 25 students to Silicon Valley during the winter break for a two-week technology entrepreneurship workshop at the Plug and Play Tech Center. The workshop is slated for January 5-16, 2009.&lt;br&gt;&lt;br&gt;The workshop sessions at the Plug and Play Tech Center will focus on innovation, technology entrepreneurship and leadership, and will feature Plug and Play’s corporate partners, venture capitalists and entrepreneurs within the incubator. Students will also have the opportunity to meet with other successful high-tech companies in the Silicon Valley area during their stay, and will have several opportunities to network with prominent entrepreneurial Illinois alumni. For full consideration, application materials must be received by 5:00 p.m. on September 12, 2008. Additional information and an application may be found at</description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1028</link>
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      <pubDate>Fri, 29 Aug 2008 00:00:00 -0500</pubDate>
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      <title>Female Mentors needed for ENG199W (CRN 34372)</title>
      <description>The Women&amp;#39;s Mentoring Class (ENG199W – CRN 34372) needs upperclass female students to mentor first-year women in this fall&amp;#39;s class. There are approximately 40 first-year women enrolled, and mentors are still needed in just about every department but especially in the following engineering departments: Ag, Bio, CS, Computer, ECE, Civil, ME, Engineering Mechanics, and Nuclear (In some engineering disciplines, there are currently no mentors at all.). Send an email to ENG199W@gmail.com to let us know that you are interested and go ahead and enroll. It is not too late to register; this is a  one-hour graded elective course.</description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1035</link>
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      <pubDate>Fri, 29 Aug 2008 00:00:00 -0500</pubDate>
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      <title>Fall Charm School</title>
      <description>Would you like to...Get a job?...Impress your professors?...Sell a product?...Start a company? If you are interested in any of the topics, you should attend the Fall Charm School hosted by the Technology Entrepreneur Center. There you&amp;#39;ll learn the finer points of networking, effective business communication, searching for and landing a job, and business etiquette. Lunch and snacks will be provided. Space is limited, so register early.</description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1027</link>
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      <pubDate>Fri, 29 Aug 2008 00:00:00 -0500</pubDate>
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      <title>iVentures10 Student Start-up Demo Day</title>
      <description>Come cheer on fellow Illinois Engineering students as they present their start-up ventures to investors at the iVentures10 Demo Day event. The teams worked as part of the iVentures10 summer internship project to launch their companies and develop their product prototypes. Now, they&amp;#39;ll be showcasing their work to potential investors and you! Illinois student companies include FusionIM, Athena Advertising, and Fashion Latte.</description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1034</link>
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      <pubDate>Thu, 28 Aug 2008 00:00:00 -0500</pubDate>
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      <title>Evening with Industry</title>
      <description>Eta Kappa Nu will be hosting Evening with Industry (EWI)--an excellent opportunity for students to interact closely with company representatives over a banquet dinner. Companies attending include Cisco Systems, Goldman Sachs, IBM, Marvell Semiconductors, Microsoft, and Northrop Grumman. Space for the banquet dinner will be limited but the info session portion starting at 5:00 p.m. and 6:00 p.m. in Seibel Center will remain open to all. There will be a $5.00 registration fee for the banquet for non-Eta Kappa Nu members. Register by September 5th at</description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1030</link>
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      <pubDate>Thu, 28 Aug 2008 00:00:00 -0500</pubDate>
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      <title>NPRE 50th Anniversary Celebration</title>
      <description>Marking a half century of nuclear engineering teaching and research at the University of Illinois at Urbana-Champaign, “NPRE: Celebrating 50 Years at Illinois,” will feature high-profile experts in nuclear energy policy-making, production and education, as well as will call together alumni for an on-campus reunion. &lt;br&gt;&lt;br&gt;Guests can register on-line at www.ne.uiuc.edu/50th/registration.php. Guests planning to attend the dinner on Friday and the tent party on Saturday are asked to pay a $60 registration fee per person. Guests who plan to attend the talks, only, will not be charged, but should email conferences@uiuc.edu and include NPRE 50th in the subject line. For more information, contact Idell Dollison at dollison@illinois.edu or by calling 217/333-2295. See the complete schedule is available at</description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1033</link>
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      <pubDate>Thu, 28 Aug 2008 00:00:00 -0500</pubDate>
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      <title>ECE Alumni Panel and Reception</title>
      <description>Want to network with experienced professionals? Receive career advice from alumni? Then you should attend the Alumni Panel and Reception, &amp;#39;Interviewing Tips and Career Advice,&amp;#39; hosted by ECESAC. The panel will be held from 1:30-3:00 p.m. in 151 Everitt Lab and the reception will be immediately following from 2:00-3:00 p.m. in 159 Everitt Lab. Ice cream sundae bar will be served.&lt;br&gt;&lt;br&gt;The alumni on the panel represent such companies as Lockheed Martin, Sandia Labs, Microchip Technologies, Texas Instruments, and Hanley, Flight &amp; Zimmerman, LLC. Questions? Contact Jill Jarboe, alumni and student relations coordinator, jjarboe@illinois.edu, or 333-5817. Register by Tuesday, September 2 at </description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1032</link>
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      <pubDate>Wed, 27 Aug 2008 00:00:00 -0500</pubDate>
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      <title>ECE Freshmen Fusion</title>
      <description>Get your career as an electrical and computer engineering student started right at the ECE Freshmen Fusion. You&amp;#39;ll hear brief comments from faculty, an alumnus, and a student. We&amp;#39;ll provide FREE pizza and representatives from several student organizations will be on-hand. All freshmen in attendance will receive a free Class of 2012 ECE t-shirt. &lt;br&gt;&lt;br&gt;Freshman Fusion will last for approximately 90 minutes. We strongly recommend you attend the entire program. However, if other obligations require it, you&amp;#39;re welcome to join us late or leave early. RSVP by September 2 at </description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1031</link>
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      <pubDate>Wed, 27 Aug 2008 00:00:00 -0500</pubDate>
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      <title>Expedia Tech Talk/Info Session</title>
      <description>Ready to get your geek on?  Expedia is hosting a Tech Talk/Info Session. This is a great chance to take a break from the books, enjoy some free food, and learn how Expedia&amp;#39;s technology is innovating in the travel industry.&lt;br&gt;What&amp;#39;s in it for you?&lt;br&gt;- Interesting topics: Expedia Labs, UI Design/Innovation, Market Making (predicting preferences), Best Fare Search, Fraudster-Catching technology, and more.&lt;br&gt;- Free food: Expedia is a food-centric company. There&amp;#39;ll be plenty of pizza and soda to go around.&lt;br&gt;- Sweet prizes: Would a $250 Expedia.com Travel Coupon help your winter break travel plans?&lt;br&gt;- Bring a résumé if you&amp;#39;d like. Expedia is hiring interns and full-time folks as software developers, program managers, network engineers, database administrators, and more. Questions, contact Bonnie Morse, bmorse@expedia.com.</description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1025</link>
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      <pubDate>Tue, 26 Aug 2008 00:00:00 -0500</pubDate>
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      <title>Gerdau Ameristeel Info Session</title>
      <description>This info session, hosted by SWE, features representatives from Gerdau Ameristeel who will discuss the various engineering opportunities there. Gerdau Ameristeel is the fourth largest overall steel company and the second largest minimill steel producer in North America. Refreshments and giveaways will be provided. Email Emily, ecarrol2@uiuc.edu, if you would like to participate in this event.</description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1022</link>
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      <pubDate>Sun, 24 Aug 2008 00:00:00 -0500</pubDate>
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      <title>Life In Industry Presentation from Dow Corning</title>
      <description>Hosted by SWE, “Time to Face the &amp;#39;Real World&amp;#39; – Life in Industry” is about the differences between life at school versus life in the corporate world. Examples of how time management needs to change, how integrating with your friends may change (usually for the better), and how other aspects of life are different. We&amp;#39;ll also provide some examples of what technical professionals do at Dow Corning to give some perspective on what to expect when pursuing an industrial career. Pizza and pop will also be provided.</description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1023</link>
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      <pubDate>Sun, 24 Aug 2008 00:00:00 -0500</pubDate>
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      <title>Panel Session with Cisco</title>
      <description>Hosted by SWE, Cisco is holding a Panel Session and Network Reception with Cisco Choice New Hires. Come prepared with any questions you may have about Cisco and working for their company. Food will be provided.</description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1024</link>
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      <pubDate>Sun, 24 Aug 2008 00:00:00 -0500</pubDate>
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      <title>SWE Roundtable with Special Metals Corporation</title>
      <description>Come to Moonstruck to speak with representatives from Special Metals Corporation in a casual atmosphere with free coffee and chocolates. Contact Emily, ecarrol2@illinois.edu, if interested.</description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1021</link>
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      <pubDate>Fri, 22 Aug 2008 00:00:00 -0500</pubDate>
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      <title>Fall 2008 Case Competition</title>
      <description>Illinois Consulting Club and The Firm Consulting present Fall 2008 Case Competition judged by representatives from McKinsey &amp; Company. Attend the Information session on August 27 for further information. &lt;br&gt;&lt;br&gt;Applications NOW available at www.uiuc.edu/goto/icc Deadline to Apply: Friday, August 29, 2008, 8:00 a.m. Membership Fee: $20 (All applicants must be members of ICC to participate. The Firm Consulting members can pay $10 to become ICC members) The first and second place teams win an office visit to McKinsey &amp; Company in Chicago, mock case interviews, network with consultants at McKinsey &amp;Company, Q&amp;A sessions with employees at all levels of the firm and more... &lt;br&gt;Questions? Contact Sindhura Mekala, smekala2@illinois.edu.</description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1019</link>
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      <pubDate>Fri, 22 Aug 2008 00:00:00 -0500</pubDate>
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      <title>SWE 1st General Meeting</title>
      <description>Come out to the first general meeting for the Society of Women Engineers hosted by IBM. Food and refreshments will be provided.</description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1018</link>
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      <pubDate>Thu, 21 Aug 2008 00:00:00 -0500</pubDate>
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      <title>Future Engineers Scholarship Program</title>
      <description>Kelly Engineering Resources®--an engineering employment provider--offers the Future Engineers Scholarship Program. This national program will award one outstanding sophomore- or junior-level student with $5,000 for 2009 tuition expenses for a student who demonstrates:&lt;br&gt;- Great potential for, and commitment to, a career in engineering&lt;br&gt;- Outstanding academic performance&lt;br&gt;- Depth of engineering knowledge on a given topic&lt;br&gt;- Essay creativity, composition, and originality&lt;br&gt;- For more information regarding the Future Engineers Scholarship Program and to download application materials, visit </description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1017</link>
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      <pubDate>Wed, 20 Aug 2008 00:00:00 -0500</pubDate>
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      <title>Hirschi named Assistant Dean</title>
      <description>Professor Michael C. Hirschi has been named as an assistant dean in the Office of Undergraduate Programs. In addition to being part of the student advising team, Dean Hirschi will also manage scholarships and associated gift funds. A professor in the Department of Agricultural and and Biological Engineering, Hirschi earned his BAgE and MSAgE in agricultural engineering from the University of Minnesota, and his PhD in agricultural engineering from the University of Kentucky. </description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1016</link>
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      <pubDate>Mon, 18 Aug 2008 00:00:00 -0500</pubDate>
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      <title>ECS Engineering Career Fair</title>
      <description>Meet and talk with more than 115 employers at the Engineering Career Services Career Fair. This year&amp;#39;s fair is much earlier than in the past, so be sure to get your résumé ready and find your business suit. The I Hotel is located on South First, across from the Research Park and the Assembly Hall. Parking is free at the conference center or you can take the MTD 23 Shuttle bus. Employers will be recruiting for full-time, intern, and co-op positions, so take advantage of this opportunity to get an early start.  </description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1010</link>
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      <pubDate>Mon, 11 Aug 2008 00:00:00 -0500</pubDate>
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      <title>ECS Upcoming Events</title>
      <description>Below you will find some upcoming events that ECS is hosting to help you get prepared for the upcoming Career Fairs. &lt;br&gt;- August 27 - HOW TO WRITE A RESUME WORKSHOP, 5:00-6:00 p.m., 1310 DCL   &lt;br&gt;- August 28 - HOW TO WORK A CAREER FAIR, 5:00-6:00 p.m., 1310 DCL   &lt;br&gt;- September 3 - ECS CAREER FAIR, 10:00 a.m.-4:00 p.m., I-Hotel Conference Center   &lt;br&gt;- September 4 - EFFECTIVE INTERVIEWING, 5:00-6:00 p.m., 1310 DCL&lt;br&gt;- September 4 - MAKING THE MOST OF A CAREER FAIR, 6:00-7:00 p.m., 1310 DCL&lt;br&gt;&lt;br&gt;You can learn more about these workshops by logging on the Symplicity. Don&amp;#39;t have a Symplicity account yet?  Get started by going here to register: </description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1015</link>
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      <pubDate>Fri, 08 Aug 2008 00:00:00 -0500</pubDate>
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      <title>New MEP Director Named</title>
      <description>Ivan Favila, has been named Assistant Dean and Director of the Morrill Engineering Program within the College of Engineering. An Illinois alumnus (BS 1994, GE), Favila previously served as Director of the Minority Engineering Program at Notre Dame, as the assistant director of the Minority Engineering Recruitment and Retention Program at the University of Illinois at Chicago, and director of the Cooperative Engineering Education Program. &lt;br&gt;&lt;br&gt;Formalized in 1973, the goal of the MEP (then called the Minority Engineering Program) was to increase the retention of students from underrepresented groups in engineering. Through MEP, several generations of students have academic support services and activities, financial assistance, scholarships, work experience, and community. </description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1009</link>
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      <pubDate>Wed, 30 Jul 2008 00:00:00 -0500</pubDate>
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      <title>Live EDGE 2008--International $100,000 USD Challenge in support of Green Design</title>
      <description>Premier Farnell plc, the leading multi-channel, high service distributor and its companies (Newark, Farnell, Premier Electronics, CPC, Farnell-Newark and MCM) today launched its international competition Live Edge--Electronic Design for the Global Environment, now in its second year. The competition is designed to provide a forum where electronic design engineers and students can design products that are environmentally friendly through the use of electronic components. &lt;br&gt;&lt;br&gt;Entries can be submitted between October 1, 2008 and January 31, 2009; winners will be announced on the April 2, 2009. The competition is open to anyone aged 18 or over. Electronics engineers, students and inventors around the world are invited to submit designs for an innovative product that utilises electronic components and has a positive impact on the environment, for example by increasing energy efficiency or reducing carbon emissions. Full details are available at </description>
      <link>http://www.engr.uiuc.edu/Publications/eupdate/viewarticle.php?ArticleID=1003</link>
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      <pubDate>Wed, 14 May 2008 00:00:00 -0500</pubDate>
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