The Microelectronics Laboratory is multidisciplinary research facility in the College of Engineering that houses and supports the programs of the Center for Compound Semiconductor Microelectronics (CCSM). CCSM programs are organized into four research areas:

   The Optoelectronics and Photonic Systems area focuses on the conceptualization, design, fabrication, and testing of microelectronic and optoelectronic devices, circuits, components and systems for lightwave communications and parallel optical interconnects. Pioneering work in this area includes III-V native oxides for fabrication of photonic devices, strained layer lasers, ultranarrow line width tuneable laser diodes, integrated optoelectronic receivers, and a fully functional optical interconnect testbed incorporating a scalable asynchronous transfer mode (ATM) switch.

   The activities of the Microelectronics for Wireless Communications area include the design and fabrication of state-of-the-art, low-cost, low-power RF and microwave monolithic integrated circuits (MMICs) and GHz analog-to-digital converters for insertion into wireless communications systems, HDTV, and advanced digital radar systems. The U of I's leading position in InGaP and InGaAs HBT technology, GaAs MESFETs, III-V p-HEMTs, and III-V native oxide technology attracts strong support from industry.

   The development of growth, characterization, and processing technology for a broad range of III-V semiconductor materials, quantum wells, superlatices, and nanostructures is carried out in the Semiconductor Materials and Quantum Structures area. Synthesis of layered III-V semiconductor heterostructures is provided by a variety of solid-source and gas-source molecular beam epitaxy and metalorganic chemical vapor deposition systems. Lateral patterning of nanostructures is accomplished by high-resolution direct-write e-beam lithography and a variety of dry (RIE and CAIBE) and wet etching techniques.

   The advantages of Microelectromechanical Systems (MEMS) devices and micromachining technology include small size and mass, large array capability, mass production capability, and full integration with electronics. The program focuses on the development of micromachining capabilities for multiple materials such as silicon, gallium arsenide and polymers to enable future applications in many interdisciplinary areas, including wireless communications, optoelectronics, biomedical engineering, and microfluidic molecular systems.

   In addition to federal and state funding, CCSM researchers have established an extensive network of industry interactions which provide opportunities for collaborative research, student research experiences in industry laboratories seminar exchanges, as well as funding, in-kind support and other resources for the laboratory's research programs.

   Additonal laboratory equipment includes state-of-the-art equipment for ultrahigh-speed optical and electrical measurements for the evaluation of microelectronic and optoelectronic devices and circuits. The Microelectronics Laboratory is one of the nation's largest and most sophisticated university-based III-V semiconductor research facilities, containing 8,000 square feet of class 100 and class 1000 clean room laboratory space.

Faculty associated with the Microelectronic Laboratory and its Center for Compound Semiconductor Microelectronics are listed below. Research projects conducted in the College of Engineering are described in the respective departmental sections.

Department of Electrical and Computer Engineering

I. Adesida
D. Beebe
S. G. Bishop
D. J. Brady
K. Y. Cheng
J. J. Coleman
M. Feng
K. Hess
N. Holonyak, Jr.
K. C. Hsieh
J. P. Leburton
C. Liu
G. Papen
U. Ravaioli
E. Rosenbaum
J. Schutt-Aine
G. E. Stillman

Department of Mechanical and Industrial Engineering

C. Liu
M. Shannon