SEMICONDUCTORS

Photoluminescence Studies of Semiconductor Materials, Heterostructures, and Processing for Optoelectronic Devices

S. G. Bishop,Principal Investigator I. Adesida,Principal Investigator D. J. Brady,Principal Investigator J. J. Coleman,Principal Investigator J. T. Verdeyen,Principal Investigator S. Kim, S. Ramachandran, E. Reuter, D. Turnbull
NSF Center for Compound Semiconductor Microelectronics

This research program applies photoluminescence (PL), photoluminescence excitation spectroscopy, time-resolved PL and PL imaging to the characterization of defects and impurities in bulk and epitaxial semiconductor materials; the composition, doping, thickness, interfaces, and uniformity of layered semiconductor heterostructures; rare earth-doped semiconducting glasses; and the effects of patterning and fabrication processing steps on the electronic and optical properties of photonic and optoelectronic devices.

Center for Optoelectronics Science and Technology (COST)

S. G. Bishop,Principal Investigator I. Adesida, D. Brady, J. J. Coleman, M. Feng, N. Holonyak, Jr., S. M. Kang, G. C. Papen, G. E. Stillman
Defense Advanced Research Projects Agency, MDA 972-94-1-0004 4. The Center for Optoelectronics Science and Technology (COST) comprises a consortium of engineering faculty from UIUC, University of Michigan, and University of Texas. The COST research program includes: optoelectronic (OE) systems integration; OE software tools; optimal specifications of OE devices; OE systems testbeds; materials issues for OEIC packaging; integrable, reliable, temperature-invariant and tunable lasers; multiwavelength lasers and arrays for WDM; processing for laser fabrication; ultrashort pulse lasers; high-speed optical pulse shapers; hybrid receivers for 1550 nm; GaAs MSM/MESFET OEIC receivers (single and multichannel arrays); SiGe/Si receivers; and InGaAs/InP HBT-based OEIC receivers.
iPOINT Testbed for Optoelectronic Systems

R. H. CampbellPrincipal Investigator (Comput. Sci.), S. M. Kang,Principal Investigator S. Ho, C. Cheong, J. Lockwood
NSF Center for Compound Semiconductor Microelectronics 4. iPOINT is the Illinois pulsar-based optical interconnect testbed in which a multitude of high-power workstations are connected with broad bandwidth optical fibers, photoreceivers, and optical transmitters. This project is carried out in collaboration with the Department of Computer Science and is linked with AT&T's Blanca gigabit network project. This project provides systems-driven specifications for optoelectronic devices and testing environment for fabricated devices. At the same time, new architectures and systems applications are investigated based on opto electronics technology.
In Situ
Processing and Regrowth of InGaAsP/InP Optoelectronic Devices
K. Y. Cheng,Principal Investigator G. E. Stillman,Principal Investigator A. M. Moy, S. Thomas
Joint Services Electronics Program, N00014-96-1-0129
(Conducted in the Coordinated Science Laboratory) 4. The goal of this proposed research is to develop key technologies in areas of ultrahigh vacuum (UHV) compatible surface etching, in situ surface cleaning, and molecular beam epitaxial (MBE) regrowth of InGaAsP compounds. A UHV compatible etching technique will be used to minimize process-induced damage on patterned GaInAsP surfaces. In situ surface cleaning will be used immediately before MBE crystal overgrowth inside the growth chamber so as to enhance the quality of the overgrowth interface. The performance of the traditional devices can be greatly enhanced and nanostructure devices with ideal performance can be realized.


Growth of Quantum-Wire Heterostructures by Molecular Beam Epitaxy

K. Y. ChengPrincipal Investigator
National Science Foundation, DMR 89-20538
(In cooperation with the Materials Research Laboratory)

This program investigates III-V semiconductor quantum-wire (QWR) structures grown by solid and gas source molecular beam epitaxy. Spontaneous strain-induced lateral layer ordering process which occurs during growth of short-period superlattice heterostructures will be used to prepare the QWR structures with the wire size of less than 100;aoA ;ts 100;aoA. The influence of the growth conditions, such as the growth temperature, the V/III flux ratio, and the magnitude of the strain on structural and optical properties of the QWR structures will be studied.


Heterojunction Device Structures by Molecular Beam Epitaxy (MBE)

K. Y. ChengPrincipal Investigator
NSF Center for Compound Semiconductor Microelectronics

Multiple-layer heterostructure devices such as HEMTs and HBTs have shown great promise recently as devices for optoelectronic integrated circuit (OEIC) receiver applications. In this project, various heterojunction OEIC structures will be prepared, characterized, and optimized. The short wavelength (0.85 ;gmm) and long wavelength (1.3 ;sl 1.55 ;gmm) OEIC receivers based on HEMT and HBT technologies will be grown by solid source and gas source MBE, respectively, using either the highly developed AlGaAs/GaAs materials system or the advanced AlInAs/GaInAs/InP and GaInAsP/InP heterostructure materials systems.


Integration of Light-emitting Devices, Photodetectors, and Si-based Transistors

K. C. Hsieh, B. Flachsbart, P. Liu
NSF Center for Compound Semiconductor Microelectronics

It is still a challenge to integrate the GaAs-based light-emitting devices and the well-established Si-based transistor technology. It has been our continuous effort to improve the reliability, although it remains a key concern for fabricating monolithic GaAs laser structures on Si substrates. Hybrid integration provides a promising alternative to the monolithic approach. We are studying the availability of physically attaching the readily made light-emitting devices and/or photodetectors on the Si substrates by flip chip bonding technique. Environmental concern leads to the development of a silver-tin-based alloy containing no lead as the solder bump. Study is under way to realize optimum processing conditions.


Strain and Phase Separation in Nanostructure Devices

K. C. Hsieh,Principal Investigator P. Liu, L. J. Chou
National Science Foundation, DMR 89-20538
(In cooperation with the Materials Research Laboratory)

This investigation focuses on exploring the relationship between strain and phase separation in III-V semiconductors with the intention of using phase separation to achieve nanostructure devices. In situ strain can be introduced by either strain-balanced short-period superlattice technique in InGaP/GaAs and InGaAs/InP systems or by an excess incorporation of As in AlGaAs grown at low temperatures. 1-D or 2-D compositional modulation have been observed. Work is underway to realize modulation in ternary alloys by applying ex situ strain through growth of lattice mismatched cap layers. Control of modulation is of great technological importance.


Development of InGaAs(P)/InP HBT-based OEIC Receivers

G. E. Stillman,Principal Investigator J. Miller, M. Fresina, D. Ahmari, S. Thomas, H. C. Kuo
NSF Center for Compound Semiconductor Microelectronics

The objective of this project is to develop an OEIC photoreceiver integrating a wide-bandwidth multistage I nGaAs/InP HBT-based amplifier with an InGaAs(P) p-i-n [fj photodiode for application to 1.3 and 1.55 ;gmm fiber-optic communication networks. The device structures are grown by chemical beam epitaxy utilizing either C-doped or Be-doped base regions in the HBTs. The lower section of the HBT structure (base to subcollector) comprises the p + -i-n photodiode structure, thereby providing both electrical and optical device structures necessary for integration in a single growth.


Growth and Characterization of Carbon-doped InGaP/GaAs for Heterojunction Bipolar Transistor Applications

G. E. Stillman,Principal Investigator S. Thomas, M. Fresina, D. Ahmari, H.-C. Kuo
Lockheed-Martin, AF L-M PO;ns FFM266926

The objective of this project is to develop the chemical beam epitaxy (CBE) growth technique for the deposition of high-quality GaAs and InGaP for high-speed heterojunction bipolar transistors (HBTs). Research under this project involves material characterization using a variety of techniques as well as electrical characterization of devices fabricated from the grown layers. The new sources including TEIn and TIBGa will be investigated as possible sources for the growth of high-quality InGaP. Additionally, the effects of growth parameters on the quality of interfaces will be investigated in order to produce hyper-abrupt composition as well as dopant changes.


OEIC Development Based on InGaAs(P)/InP Material System

G. E. Stillman,Principal Investigator S. Thomas, D. Ahmari, M. Fresina, C. A. Martino, J. Miller
DARPA Center for Optoelectronics Science and Technology

This project entails the growth and material characterization of high-quality InGaAs(P) layers latticed matched to InP for the development of HBTs and PINs using two novel growth techniques, GSMBE and CBE. Initial work will concentrate on the development of HBTs with a C-doped base using CCl;i4 and CBr;i4. Carbon is the preferred dopant for the development of high-reliability HBTs because of its low diffusivity. PIN detectors will be integrated in order to develop OEICs for 1.3 and 1.55 ;gmm fiberoptic communication networks.


100-GHz InGaP/GaAs HBT ADC Technology

G. E. Stillman,Principal Investigator M. Feng,Principal Investigator D. Ahmari, Q. J. Hartmann, D. Barlage, Q. Yang, J. Mu
University of Illinois

The goal of this project is the realization of high-speed circuits based on 100-GHz InGaP/GaAs:C heterojunction bipolar transistor (HBT) technology. The material will be grown by LP-MOCVD. Device structures implementing thin collector widths and graded base designs will be used to reach the 100-GHz goal. Self-aligned collector and base etches will also be used to minimize parasitic effects. A device model will be developed for designing and demonstrating high-speed A/D circuit components.


Materials Research for High-Performance Optoelectronic Devices Employing III-V Compound Semiconductor Native Oxide Layers

G. E. Stillman,Principal Investigator N. Holonyak, Jr.,Principal Investigator A. P. Curtis
National Science Foundation, DMR-9612283; University of Texas-Austin

The primary thrust of this program is the growth and characterization of heteroepitaxial materials employing native oxide layers. A variety of optoelectronic structures are being grown by MOCVD including AlGaAs/GaAs, InAlP/GaAs, and InAlP/InGaP double heterostructures. Currently under investigation are the minority carrier lifetime in the active regions, the interface recombination velocity between the active and oxide regions, and the effect of various oxidation conditions upon interface abruptness and impurity distributions. The results of this research will enable further advances in VCSEL (laser), field-effect transistor (MOSFET), and other technologies utilizing native oxide layers.


Development of Low-Resistance Contacts for InGaP/GaAs Heterojunction Bipolar Transistors

G. E. Stillman,Principal Investigator S. Thomas, M. Fresina, D. Ahmari, H.-C. Kuo
Defense Advanced Research Projects Agency, ASSERT, DAAH04-95-1-0352

Research under this project involves the investigation into alternative contacting structures for InGaP/GaAs HBTs. Currently, latticed-mismatched InGaAs layers are used to form low-resistance contacts to InGaP/GaAs HBTs. These contacts, however, have shown reliability problems from the strain induced by the lattice-mismatch. N+-GaAs and N+-InGaP grown using the CBE growth technique and SiBr;i4 as the n-type dopant source will be investigated as an alternative to InGaAs. Subsequently, the effect of the new contacting layers on device performance will be evaluated.


Integration of Heavily Si-doped InP Contacting Layers for InP/InGaAs HBTs

G. E. Stillman,Principal Investigator M. Fresina, D. Ahmari, S. Thomas, H.-C. Kuo, D. Scott
Defense Advanced Research Projects Agency, AASERT, DAAH04-96-1-0217

This program is aimed at developing InP/InGaAs heterojunction bipolar transistors that utilize heavily doped InP layers as low-resistance contacting layers. InP has improved thermal conductivity over InGaAs, the material used currently for HBT contacting layers. Under this project, a fully self-aligned, high-frequency fabrication process will be developed. High-frequency electrical characterization will be used to evaluate the effect of InP contacting layers on device performance.

SOLID-STATE DEVICES

L uminescence and Laser Studies in III-V Semiconductors
N. Holonyak, Jr.,Principal Investigator P. Evans, J. Wierer, D. Kellogg
National Science Foundation, ECS 82-00517
(In conjunction with the Department of Physics)

Heterojunctions in Al x Ga 1- x As-GaAs and related materials are being examined. Quantum size effects have been observed and have led to single and multiple active layer quantum-well diode light emitters and lasers. Stimulated emission, absorption, disorder, alloy clustering, carrier scattering, phonon processes, tunneling effects, and impurity diffusion in these structures are being studied. Impurity-induced disordering and Al-bearing native oxides are being studied and used to form stripe-geometry lasers and more complicated array structures. Quantum well lasers have been operated in an external grating cavity in an extended wavelength range. Newer forms of quantum-well lasers have been realized, including native-oxide-defined lasers and waveguides.

Quantum-Well Heterostructures

N. Holonyak, Jr.,Principal Investigator P. Evans, J. Wierer, D. Kellogg
National Science Foundation, DMR 89-20538
(In cooperation with the Department of Physics and the Materials Research Laboratory)

The fundamental properties of III-V heterostructures grown by vapor phase epitaxy are being studied. On quantum-well MOCVD AlGaAs-GaAs heterostructures, laser operation 400 meV above E g (GaAs) has been observed, the first cw 300 K laser operation has been achieved, laser operation on phonon-sidebands below the confined-particle states has been observed, and alloy disorder and clustering in quantum well heterostructures have been identified. Impurity-induced disordering of quantum-well hetero structures and Al-bearing native oxides, e.g., the native oxide of Al;yxGa;i1 -x As formed at 400° to 500°C with H;i2O + N;i2, are being examined via TEM and photoluminescence studies. This project is the first (1977) to realize p-n quantum-well lasers and to ``coin'' the name ``QW lasers.''