The electromagnetic modeling of packages and interconnects plays a very important role in the design of high-speed digital circuits and is most efficiently performed by using computer-aided design algorithms. In the past two decades, researchers in the electromagnetic and microwave areas have striven to extend the knowledge of interconnection properties. Presently, algorithms are available that model complex interconnect structures; however, because of the extensive computations involved, only portions or subsets of a whole system are modeled in existing computer-aided design (CAD) tools. The objective is to assess the computational performance of the different architectures and the possible implementation of a CAD tool for interconnects in the supercomputer platform.

The electrical performance of high-speed integrated circuit and digital networks strongly depends on the electromagnetic performance of interconnects between components of a system. Packaging has become a critical area in the design of high-speed communications systems and fast computers. Our purpose is to provide the support technology necessary for aggressive packaging schemes in the areas of design, modeling, testing, measurement, and circuit simulation. This will be achieved by using electromagnetic theory as an analysis tool to yield a better understanding of interconnect problems. New design ideas will be studied and evaluated and solutions will be proposed for current system level integration problems.

The development of efficient and accurate computer-aided design tools is essential for the implementation of high-speed digital circuits used in computer systems and communication networks. With current trends in which network complexity and signal speed keep increasing, problems associated with signal integrity such as crosstalk, distortion losses can compromise the overall electrical performance of computers and communication systems. Presently, industrial needs for computer support in network design is increasing rapidly; however, there is a serious lag in the availability of design and analysis tools capable of handling the complexity and volume of manufactured systems.