This research involves developing modeling and simulation algorithms useful for the design of electronics packages for communication high-speed digital circuits. We are developing computer programs for predicting cross-talk noise and signal distortion in chip-level and board-level interconnect circuits involving
n
-conductor transmission lines driven by digital devices. Electromagnetic modeling of these lines and discontinuities, e.g., vias and bends, is being developed on high-performance workstations, machines with parallel architecture, and distributed systems.
In this effort we are investigating communication an-
tennas for wideband communication covering the range
2 MHz to 3 GHz. Novel designs, including loaded antennas, are being investigated. Optimization techniques, including the genetic algorithms, are being utilized. Characteristics of antennas mounted on complex structures are being
investigated.
Integral equations, finite element (FEM) and finite difference time domain (FDTD) methods are being developed for the solution of a variety of electromagnetic modeling of microwave circuits and antennas. The study includes the development of the FDTD and the FETD algorithms on an unstructured grid.
Packaging and interconnects nowadays represent a critical area for the design of high-performance digital systems. State-of-the-art computational electromagnetic techniques necessitate large processing power and memory requirements. Algorithms are available that model complex interconnect structures; however, because of the extensive computations involved, only portions or subsets of a whole system are modeled in existing computer-aided design (CAD) tools. This project focuses in the implementation of electromagnetic modeling and simulation tools in distributed computer systems. The objective is to assess the computational performance of the different architectures and the possible implementation of a CAD tool for interconnects in the distributed platform.
The objective is to develop a comprehensive approach to the generation of design guidelines in high-speed optoelectronics communications requiring use of optical-electronic interfaces that combines modeling and simulation tools with experimental information. These interfaces must handle information at gigabit rates within very small dimensions. At those signal speeds and dimensions, crosstalks and other noise phenomena cannot be avoided; therefore, they must be properly managed and controlled with ac curate transmission-line simulation and design tools. Extensive simulation of signal transmission through these structures can dramatically reduce cost and turnaround time associated with the manufacturing process. To maintain signal integrity, issues pertaining to crosstalk and signal reflections must also be addressed.